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- 9 Fully Integrated SMT lines
- Surface Mount Technology (SMT)
- Ball Grid Array (BGA)
- mBGA
- 01005
- Reflow with Nitrogen Option and Selective Cooling
- Through Hole
- 10K Class Clean Room for Die Bonding (COB)
- On-Line Programming
- Wave Soldering
- Conformal Coating
- Encapsulation and Potting
- 3D X-Ray Inspection for BGA, LGA and QFN
- Automatic Optical Inspection
- Post-solder Paste AOI
- RoHS and WEEE Compliance
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