R&D and Engineering
PCB Assembly and System Assembly
Test and Reliability
Materials Management and Logistic Support
 
PCB Assembly and System Assembly
 
  • 10 Fully Integrated SMT lines; over 650 million chips per month
  • Surface Mount Technology (SMT)
    • Ball Grid Array (BGA) ; Package on Package (POP)
    • μBGA
    • 1005
  • SMT on Flexible Circuit
  • 3D Solder Paste Inspection
  • Reflow with Nitrogen Option and Selective Cooling
  • Automatic Optical Inspection (AOI)
  • 3D X-Ray Inspection for BGA, LGA and QFN
  • Die Bonding
  • Wire Bonding
  • Class 10K Clean Room ; Class 100 Clean Booth
  • Wave Soldering
  • Selective Soldering
  • Robotic Soldering
  • Aqueous Cleaning
  • In-circuit Test & Boundary Scan Test
  • Hi-Pot, EMC and ESD Test
  • System Functional Test
  • Ultrasonic Welding
  • Press Fit for Back Plane Connectors
  • Conformal Coating
  • Encapsulation and Potting
  • In-House Test Program and Fixture Development
  • Custom made Integrated Test System
  • Radio Frequency (RF) Test
  • Anechoic Chamber for Acoustic Test
  • Static & Dynamic Burn-in Test
  • Process Control: Six Sigma, SPC tools, CpK analysis, FMEA
  • Pad printing; Silk-Screening & Laser Marking