|
|
|
|
|
|
| |
| |
|
|
 |
- 10 Fully Integrated Fuji SMT lines
- Surface Mount Technology (SMT) and Hot Air Reflow
- Ball Grid Array (BGA)
- mBGA
- 0201
- Through Hole
- Chip On Board (COB)
- On-Line Programming
- Dual Wave Soldering
- Conformal Coating and Encapsulation
- BGA X-Ray Inspection
- AOI
- IPC Workmanship Standard
- RoHS and WEEE Compliance
|
|
|
|
| |
|
|
|
